| PART |
Description |
Maker |
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| SOT926-1 |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
|
NXP Semiconductors
|
| 2-316289-0 2-917797-0 8-316289-0 5-917797-0 7-9177 |
ON TAPING (EMBOSS) 0.5mm PITCH Fine Mate CONN.
|
Tyco Electronics
|
| UPD70P3002GC-25-7EA |
32-BIT, OTPROM, 25 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, QFP-100
|
Panduit, Corp.
|
| UPD78F0536GAR-9EV-A UPD78F0537GBT2-UEU-A |
8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP64 7 X 7 MM, LEAD FREE, FINE PITCH, PLASTIC, TQFP-64
|
|
| 24-5046-030-600-829 |
Fine Pitch SMT Board to Board Connectors
|
AVX Corporation
|
| 1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
| IC280-720-106 IC280-256-211 IC280-69605.AC-08327 I |
Ball Grid Array (FBGA / CSP / LGA)
|
Yamaichi Electronics Co., Ltd.
|
| NP236-102002-1 NP236-102002-2 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
| 546-99-108-12-101-036 546-91-108-12-101-035 546-91 |
Pin Grid Array sockets Press-fit terminations 针栅阵列插座压接端子
|
PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
|
| 614-99-108-12-051-112 612-13-108-12-051-101 612-91 |
CONNECTOR ACCESSORY
Pin grid array sockets Carrier types 插针网格阵列插座载体类型
|
PREDIP[Precid-Dip Durtal SA]
PRECI-DIP SA
|
| IDT71V67613S200BQ IDT71V67613S183BG IDT71V67613S20 |
256K X 36 CACHE SRAM, 3.1 ns, PBGA165 13 X 15 MM, FINE PITCH, BGA-165
256K X 36 CACHE SRAM, 3.3 ns, PBGA119 14 X 22 MM, PLASTIC, BGA-119
256K X 36 CACHE SRAM, 3.1 ns, PQFP100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
256K X 36 CACHE SRAM, 3.3 ns, PQFP100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
256K X 36 CACHE SRAM, 3.3 ns, PBGA165 13 X 15 MM, FINE PITCH, BGA-165
256K X 36 CACHE SRAM, 3.1 ns, PBGA119 14 X 22 MM, PLASTIC, BGA-119
|
Integrated Device Technology, Inc.
|
